Assembly :: Dicing Saw

This is the wafer dicing saw. Which is used to cut the wafer up into it's individual chips.

The wafer dicing saw. So once you have decided everything is fine with it and it is thinned you bring it in here and you dice it into the actual little pieces. Into the individual chips.

How long does that process take to do?

The sawing process takes, it's quite quick, it takes about 15 minutes per wafer.

And it's all computer programmed?

It's all programmed, yes.

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Assembly :: Chip Pad

Well I'm just going to bond down onto the chip pad. And then we'll go over onto the board pad.

Onto which pad?

Board pad.

The board pad, ok so you bond onto the chip pad and then onto the board pad.  And the chip pad is actually the chip, and the board pad is?

Well, a piece of board. Piece of board that it goes onto. The package.

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Assembly :: Chip Pad Bonding Inspection

So we're doing a bit of inspection.

After the bonding process you inspect what's been done?

That's right. Yeah. These particular ones here are ones that have internal cooling on them so that white platform is a cooler that's inside the package. We put a window on top. Seal the window off and then we pump out all the air inside the device and seal it off. So that it's either in vaccuum or it's packed - filled with a special gas so they are able to run the thing at low temperatures.