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After the wafers are thinned they need to
be assembled. Depending on the size of the CCD several
devices may be on a single CCD wafer. The first step in
the assembly process is for them to be cut into their
individual devices. The cutting is done with a computer
programmed dicing saw.
After the wafers are diced they must be bonded down onto
the chip pad. The diced CCD is wired bonded onto the chip
pad. Then this pad is bonded down onto a board pad. The
board pad is a piece of board which makes up the CCD package.
Once the bonding process is done it is then inspected
to make sure everything was done correctly.
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