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Manufacturing CCDs

The CCD manufacturing process can be divided into 2 major stages, wafer fabrication and post-processing.

Wafer Fabrication

Wafer fabrication is the process by which different electrical components and structures are placed on the silicon wafers to produce CCDs. The entire process is typically done in batches of about 20 wafers at a time. Each wafer may contain from two to several dozen CCDs, depending on the size and format of the devices being fabricated. Five basic processes are used in the wafer fabrication stage and may be repeated several time in order to make the desired devices.

Post Processing

After completion of wafer fabrication, the wafers are ready for post processing, which consists of 5 major activities

wafers entering furnace
Wafer Fabrication
5 steps :: deposition, photolithography, etching, ion implantation, and annealing


Processing
5 steps: probe testing, backthinning, coating, assembly, and testing

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